Selection Guide for Semiconductor Refrigeration Module (TEA) of First Cooling Technology

Thank you for your attention to our products. The application range of semiconductor refrigeration technology is still relatively narrow, mainly used for low-power refrigeration. The following are some characteristics of some refrigeration chips/refrigeration modules summarized by our company, in order to help users quickly judge whether they can solve their needs through semiconductor refrigeration technology when carrying out innovative application design.

The following opinions only represent our opinions and are not guaranteed to be completely correct. They can be used cautiously.

The refrigeration chip/refrigeration module is essentially an electrical part, and it is also a heating device as a whole.

The cooling function of the cooling fin can be expressed as: when the cooling fin is powered on, it will transfer the heat of the cold surface to the hot surface, and then the cold surface and the hot surface will be formed. The mathematical expression is:

Cooling capacity of cold surface=electric power * cooling efficiency; (The refrigeration efficiency is the core performance index of the refrigeration chip/refrigeration module, and also the concentrated embodiment of the technical level.)

Heating capacity of hot surface=cooling capacity of cold surface+electric power; In practical application, the refrigeration efficiency is between 30% and 100%. The larger the temperature difference between the hot and cold ends (hot end temperature cold end temperature), the lower the refrigeration efficiency.

The refrigeration chips are mainly used for low power refrigeration applications. Our refrigeration components (usually using multiple refrigeration chips) have refrigeration power (when the temperature difference is 0 ℃) below 400W.

There is no scale effect on the refrigeration cost of the refrigeration chip, that is, the cost of 400W refrigeration capacity is usually more than twice that of 200W refrigeration capacity.

The main function of the cooling fin is to cool, and heat dissipation is its auxiliary function.

When the cooling fin works, because it is still a thermal device as a whole, it still needs cooling devices, such as radiators and fans. Therefore, for applications without space for cooling, using the cooling fin usually cannot help solve the cooling problem.

In actual use, the refrigeration chip consists of the cold end, the refrigeration chip and the hot end to form a system, which is called the refrigeration module. The cold end may be air, liquid or solid (usually metal), and the same is true for the hot end.