Some knowledge of thermal management solutions

Thermoelectric system design 1 The first step in designing a thermoelectric refrigeration system is to analyze the overall thermal performance of the system. This analysis process may be very simple for some applications and highly complex for others. This analysis process is indispensable if you want to obtain a satisfactory and efficient design scheme. Other more important considerations

The first step in designing a thermoelectric refrigeration system is to analyze the overall thermal performance of the system. This analysis process may be very simple for some applications and highly complex for others. This analysis process is indispensable if you want to obtain a satisfactory and efficient design scheme. Other more important factors to consider will be discussed in the following chapters. Although some simplification is needed in the calculation process, which may affect the simple dynamic process, the results obtained are still satisfactory and close to the international advanced level except for a few cases.
Note: The design information mentioned in this manual is intended to help engineers and scientists who need cooling equipment or are developing their own cooling equipment. For those customers who are not interested in the details of thermoelectric device design, we welcome you to consult our service personnel directly. Yileng Technology Co., Ltd. is committed to providing customers with the most powerful technical support, and our engineers have the ability to design complex thermoelectric related systems.
2. Effective thermal load: The effective thermal load refers to the effective heat generated by electronic components, "black boxes" or systems requiring cooling. For most application conditions, the effective thermal load is equal to the electric energy input to the cooled element (electric energy=voltage × current, w=V × A), but in other cases, it is difficult to determine this effective thermal load. However, in general, the total input electric energy can represent the maximum possible effective thermal load. We recommend that you use this value as the design parameter.
3 Heat loss: Heat loss (sometimes referred to as heat leakage loss or additional heat load) is the heat loss caused by the cooled object through heat conduction, convection or radiation. Heat loss may occur in any way that can conduct heat, such as air, insulators and wires. Under the application condition of no self generated heat, the heat loss represents the total heat load on the thermoelectric cooler.
The calculation process of total heat loss in a refrigeration system is relatively complex, but some basic heat transfer formulas can often be used to calculate these heat losses. If there is any uncertain heat loss in a given design, we recommend that you contact our engineers directly for assistance and advice.
4 Heat transfer formula: several basic heat transfer formulas are given here to assist engineers in evaluating thermal parameters in some designs or systems.
4.1 Heat conduction in solid materials: The heat conduction equation in solid materials was established by J B. Fourier. The heat conduction is related to the geometric size, thermal conductivity and temperature difference of a given block material. Although the thermal conductivity will change with the temperature change, the actual change is very small, and we can regard the thermal conductivity as constant in our calculation. Therefore, the heat transport by conduction can be expressed mathematically as:
                Q=(K)(DT)(A)
                x